Hai-Temp Dabol-Sait Polyimide Kapton Teip|260℃SMT PCB Wave-Soldering Insulation - STK
STK's High-Temp Double-Sided Polyimide Kapton Tape i makim nambawan wok bilong 'enjiniaring' bilong 'ultra-thin, high-reliability electrical insulation na 'thermal masking' we ol i wokim stret long ol strongpela envairomen bilong 'surface mount technology' (SMT), 'wave-' semiconductor, na 'semiconductor lines'. Ol i wokim long wanpela gutpela -greid, 'dimensionally steble polyimide film backing' we i gat wanpela gutpela 'thermosetting silicone pressure-sensitive adhesive (PSA) long tupela sait bilong en, na dispela teknikel tep i save givim bikpela 'physical anchoring' na 'electrical decoupling' wantaim.
Em i save karim ol bikpela 'thermal spikes' we i no gat 'shrinkage', 'curling', o 'chemical outgassing', na dispela i mekim em i nambawan samting bilong pasim ol 'flexible printed circuits' (FPCs), strongim ol 'heat-sink interfaces', na lukautim ol bikpela gol finga terminal long taim bilong ol 'automated production cycles'.
Askim Hai-Temp Dabol-Sait Polyimide Tep Holsel Prais
Enjiniaring Presisen: Zero Adhesive Residue long 260 digri Thermal Exposures
Long ol kwaliti kontrol enjinia husat i menesim ol 'high-density printed circuit board assemblies (PCBA), namba wan rot bilong bagarap bilong ol standet sab-greid hai-temperature tep em i 'adhesive transfer' o 'carbonaisation' long taim bilong 'lead-free reflow profile. Taim wanpela tep i lusim ol liklik mak bilong silikon oil long ol gol pinga o ol bikpela tes pad, dispela i save kamapim ol bikpela 'solder joint voids' o ol 'electrical contact failures'. STK's premium double-coated polyimide matrix i save daunim tru ol dispela bikpela dinau bilong prodaksen:
• Laboratory-Verified Zero Residue Matrix:
Ol i wokim bilong kisim 'structured cross-linking' taim ol i putim long 'thermal bakes', dispela tep i gat setifiket long karim ol 'thermal profiles' i go inap long260 digri (500 digri F)long 30 minit bihain long narapela o sotpela taim weiv-solda mak bilong300 digri (572 digri F). Em i save rausim ol liklik hap bilong kopa, gol, na FR-4 we i no strong tumas na i no gat wanpela samting i pas long en, o i no gat planti marasin i stap long en.
• Gutpela Dielektrik Strong Proteksen:
I gat wanpela bikpela -voltej banis kapasiti (Bikpela o wankain olsem 5.0 kVmak bilong brukdaun long wanwan leia), na mekim gutpela 'phase-to-phase 'phase' lektrik aisolesen insait long ol 'high-frequency transformers', 'lithium battery cells', na 'micro-inverter housing' we i pas gut tru.
• Flawless Dimensional Chemical Inertness:
Ol 'industrial chemical flux sprays', 'isopropyl alcohol' (IPA) 'circuit board washing solvents', na strongpela 'soldering heat' i no inap bagarapim. Em i save holim gutpela 'layout outline' na i no gat 'edge-curling o stretching.
Teknikel Spesifikasen
| Diskripsen bilong prodak | Dabol-Sait Polyimide Tep | Dabol-Sait Polyimide Tep | Dabol-Sait Polyimide Tep | Dabol-Sait Polyimide Tep |
|---|---|---|---|---|
| Tiknes bilong piksa (mm) | 0.025 | 0.025 | 0.05 | 0.075 |
| Tiknes bilong olgeta (mm) | 0.05 | 0.09 | 0.125 | 0.175 |
| Adhesive System | Silikon glu | Silikon glu | Silikon glu | Silikon glu |
| Ol samting bilong karim | Polyimide Film | Polyimide Film | Polyimide Film | Polyimide Film |
| Kala bilong lukluk | Amber | Amber | Amber | Amber |
| Rilis Laina | Fluoro Silicone Liner | Fluoro Silicone Liner | Fluoro Silicone Liner | Fluoro Silicone Liner |
| Front-Sait Peel Adhesion long Steel (N/25mm) | 7 | 8 | 8 | 8 |
| Back-Sait Peel Adhesion to Steel (N/25mm) | 6 | 7 | 7 | 7 |
| Laspela longpela (%) | 35% – 50% | 35% – 50% | 35% – 50% | 35% – 50% |
| Dielektrik Strong (kV) | 3.5 – 4 | 3.5 – 4 | 5 – 8 | 5 – 8 |
| Intermittent Temperature Resistance (digri) | 300 | 300 | 300 | 300 |
| Tempereja bilong wok oltaim (digri) | 260 | 260 | 260 | 260 |
Wok
SMT Wave-Soldering Gold Finger Maskeng:Givim tupela sait proteksen na strongpela anka bilong ol 'temporary heat shields' na ol 'component sensors' antap long ol 'circuit traces' long taim bilong 'automated soldering waves'.
'Flexible Printed Circuit (FPC) Stiffener Attachment':Strongpela pasin bilong pasim ol liklik 'polyimide' o FR-4 'stiffener plates' i go long ol 'backboards' bilong ol 'flexible display ribbon connector'.
Lithium Battery Cell Insulation Wrapping:Pasin bilong pasim ol 'positive/negative terminals' na putim ol 'high-voltage sensor lids insait long ol 'next-generation electric vehicle (EV) battery modules.
Hai-Frikwensi Transfoma Koil Intalea Insulesen:Em i wok olsem wanpela dabol-sait, hai-dielektrik banis we i separetim ol kopa winding long ol liklik switsing pawa saplai yunit.
B2B Precision Converting: Pre-Scored Liners & Custom Die-Cut Gaskets
Ol 'automated component picking lines' na ol 'high-speed electronics assembly plants i no inap long kisim ol standet 'bulk tape logs' sapos ol i no daunim ol 'units-per-hour (UPH) mak bilong ol. STK i save stretim gut prodaksen bilong yu long rot bilong ol gutpela teknikel konvesen:
Dual Fluoro-Silicone Easy-Release Liners: Long mekim isi long senisim na isi long holim, tupela -sait polyimide tep bilong mipela i stap wantaim ol gutpela, pre-skored fluoro-silikon rilis laina long tupela sait (o wanpela isi pepa lain fremwok). Dispela konfiguresen i mekim na tep i no inap stret o bagarap taim ol i rausim skin bilong en.
CAD/PDF Precision Micro Die-Katim: Salim ol 'engineering schematics' bilong yu i kam long mipela. Mipela i yusim ol 'automated flatbed' na 'high-speed rotary die-cutting machinery long senisim 'double-sided Kapton tape' i go long ol liklik 'square frames', 'washer dots', o ol 'customized terminal outlines' wantaim wanpela stretpela enjiniaring tolerans bilong $\\pm 0.05\\text{mm}$.
Ol i givim ol 'Extended Pull-Tabs': Ol 'die-cut profiles' i gat 'layout-matched long ol 'continuous clear PET carrier rolls' we i gat ol 'extended non-adhesive pull-tabs (finger-lifts). Dispela i larim ol 'automated vacuum pick-and-place SMT robotics long putim ol 'insulating pads' gut tru na i no gat 'manual line placement'.
Ikwipmen
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