Trupela 3MTM Scotch-WeldTM DP460 EG Epoxy Adhesive|Hap-Strong Low Outgassing Electronics Gred Glue - STK
STK saplaiTrupela 3M Scotch-Weld Epoxy Adhesive DP460, wanpela gutpela, hai-pefomens tu-pat 'structural adhesive' we ol i wokim stret long 'extreme-reliability microelectronics, hard disk drive (HDD) manufacturing, na aerospace electronics assembly. Long 3M's lejendari hai-strong DP460 fomula, dispela"EG" (Gred bilong Elektroniks)senis i bin kisim bikpela kemikel purifikesen long rausim ol nogut 'ionic' na 'volatile contaminants'.
Bikpela wok bilong 3M DP460 EG em i bihainim gut ol lo bilongultra-low autgassing na ultra-low chlorideol standet. Em i kamapim wanpela 'armored', 'vibration-proof structural weld' we i pasim ol bikpela 'electronic components', ol 'sensor', na ol 'micro-substrates wantaim na i no gat hevi long kemikel korosen o 'organic outgassing contamination' insait long planti yia bilong sevis.
Ol bikpela samting
Bikpela strong bilong straksa
Gutpela pasin bilong pasim ol metal, plastik, na ol komposit aninit long hevi bilong masin.
01
Elektronik Gret
I no gat planti 'ionic contamination' na i no gat planti 'outgassing', em i gutpela long ol 'sensitive electronic assemblies'.
02
Impak na Thermal Resistance
Em i lukautim gutpela bilong bon aninit long 'thermal cycling' na 'vibration'.
03
Ol kain kain opsen bilong mekim orait
Rum tempereja 'cure' o 'accelerated heat cure' bilong mekim ol prodaksen i kamap hariap.
04
Teknikel Spesifikasen
|
Kain glu |
Epoxy |
|
Wok |
Impact Resistance |
|
Ol bren |
Scotch-Weld™ |
|
Ol salens bilong disain |
Impact & Shock Absorption, Noise Vibration & Harshness Control NVH |
|
Ful Taim bilong Orait |
24 aua @ 73 F (23 C) |
|
Hatnes |
77 So D, 75 - 80 So D |
|
Ol indastri |
Konstraksen, Konsuma Guds, Elektroniks, Jeneral Indastriel, MRO, Metalwoking, Ami & Gavman, Sain, Speseliti Kar, Trenspot, Wudwoking |
|
Miks Resio Volium Bes: Akselereta |
2:1 |
|
Taim bilong opim |
60 minit |
|
Pefomens Level |
Nambawan |
|
Fom bilong bodi |
Liquid we i save ron, Liquid, Paste |
|
Prodak Fom |
Katres, Wanwan, Kit |
|
Setim Taim |
4 aua |
|
Strong bilong katim |
4500 psi |
|
Liklik yunit we ol i ken salim |
Kanista, Dram, Wanwan, Kit, Pek |
|
Spesifik Graviti |
1.08, 1.09, 1.12, 1.14 |
|
Ol spesifikasen i kamap |
UL 94 HB, ASTM E662, Bombardier SMP 800-C |
|
Tempereja bilong putim (Celsias) |
22 digri , 15 digri - 27 digri |
|
Tempereja bilong putim (Fahrenheit) |
72 Digri Fahrenheit |
|
Kain pes |
Ol i bin penim, putim paura long en, gutpela, no bin penim |
|
Taim bilong holim strong |
4 aua |
Ol aplikesen
Hard Disk Drive (HDD) Component Bonding:Holim gut ol 'read/write head armatures', 'voice coil motor' plet (VCM) plates, na ol 'micro-magnets' insait long ol klinpela rum.
Aerospace & Military Electronics:Ol 'potting' na 'structurally adhering sensor modules', ol 'navigation computer housing', na ol 'communications brackets' i kisim bikpela 'vibration g-fos.
PCB & Semiconductor Assembly:Putim ol seramik sabstret, ol 'heat sink', na ol 'structural metal pin' antap long ol 'printed circuit board' we i no gat kemikel 'vapor cross-kontaminesen.
Optical & Laser Hardware Encapsulation:Ol 'lens holders', 'fiber-optic transceiver housing', na ol 'camera sensor frames' we ol 'outgassing condensates' bai bagarapim wok bilong en.
Ikwipmen
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